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| 145 adams avenue hauppauge, ny 11788 usa tel: (631) 435-1110 fax: (631) 435-1824 www.centralsemi.com process CP392 small signal transistor npn - amp/switch transistor chip princip al device types 2n3904 cmkt3904 cmlt3904e cmpt3904 cmpt3904e cmst3904 cxt3904 czt3904 geometry process details backside collector r0 (06 -april 2004) process epitaxial planar die size 11 x 11 mils die thickness 7.0 mils base bonding pad area 3.7 x 3.7 mils emitter bonding pad area 3.7 x 3.7 mils top side metalization al - 30,000? back side metalization au - 18,000? gross die per 4 inch w afer 93,826 r0
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